Global semiconductor major, Texas Instruments has announced its plans to start construction on its new 300 mm semiconductor wafer fabrication plants. Construction of the first and second fabs is set to begin in 2022.
The plants, which will come up at Sherman in North Texas, has the potential for up to four fabs to meet demand over time, as semiconductor growth in electronics, particularly in industrial and automotive markets, is expected to continue well into the future.
The company expects production from the first new fab as early as 2025. With the option to include up to four fabs, total investment potential at the site could reach approximately $30 bn and support 3,000 direct jobs over time.
The new fabs will complement TI's existing 300-mm fabs, which include DMOS6 (Dallas, Texas), RFAB1 and the soon-to-be-completed RFAB2 (both in Richardson, Texas), which is expected to start production in the second half of 2022. Additionally, LFAB (Lehi, Utah), which TI recently acquired, is expected to begin production in early 2023.
“TI's future analogue and embedded processing 300-mm fabs at the Sherman site are part of our long-term capacity planning to continue to strengthen our manufacturing and technology competitive advantage and support our customers' demand in the coming decades,” said Rich Templeton, Chairman, President & CEO, TI.