Tessolve To Acquire Dream Chip Technologies, Strengthening Automotive & ADAS Chip Design Capabilities

Abhijeet Singh
06 Nov 2024
02:01 PM
2 Min Read

Valued at up to INR 400 crore, this acquisition propels Tessolve into a select group of global firms with end-to-end design capabilities for complex semiconductor solutions.


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Tessolve, a semiconductor engineering company under Hero Electronix, has announced its agreement to acquire German-based Dream Chip Technologies. Pending regulatory approvals this acquisition will enhance Tessolve’s technological capabilities and expand its influence in the European market through Dream Chip’s established facilities in Germany and the Netherlands.

This acquisition strategically positions Tessolve at the forefront of the automotive semiconductor sector which is a field increasingly demanding advanced custom chip designs for AI-powered and camera-based ADAS solutions. With Dream Chip Technologies’ expertise in digital chip architecture and embedded software, Tessolve will now be equipped to offer turnkey solutions covering the entire development process—from chip architecture to silicon production. This capability is expected to accelerate time-to-market for clients providing them with a critical edge in the rapidly evolving automotive and ADAS sectors.

Srini Chinamilli, CEO of Tessolve, highlighted that Dream Chip’s capabilities in digital design and embedded solutions will substantially boost Tessolve’s capacity to undertake complex Application-Specific Integrated Circuit (ASIC) projects. This expanded capability is particularly beneficial for Tessolve’s automotive and industrial clients who increasingly rely on advanced system-on-chip (SoC) designs for applications in AI, imaging, and data centres. With the addition of Dream Chip’s specialised ADAS and imaging lab, Tessolve will now be able to deliver innovative automotive solutions tailored for next-generation vehicle safety and autonomy.

Dream Chip Technologies is highly regarded in Europe for its expertise in digital design and has built a reputation for tackling intricate semiconductor challenges. The acquisition will integrate Dream Chip’s front-end design strengths with Tessolve’s capabilities in post-silicon testing, packaging, and supply chain management. This fusion will allow Tessolve to offer a comprehensive suite of semiconductor solutions that not only meets operational excellence standards but also ensures rapid, reliable delivery—a critical requirement in the automotive sector.

According to Jens Benndorf, CEO of Dream Chip Technologies, the merger with Tessolve will create a robust global platform for chip architecture, embedded software, and semiconductor testing services. He emphasised that the combined expertise in camera-based and AI-driven ASIC designs will allow Tessolve and Dream Chip to push boundaries in automotive and enterprise-grade semiconductor solutions.

Ujjwal Munjal, Chairman of Tessolve, expressed confidence in Tessolve’s expanded potential within the custom chip design market, which is seeing growing demand from automotive manufacturers seeking bespoke, high-performance ADAS and AI solutions. By acquiring Dream Chip, Tessolve positions itself to respond effectively to the evolving needs of the automotive semiconductor market, solidifying its status as a key player in providing full-stack design services to an increasingly global client base.

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