Tessolve has announced a strategic collaboration with SigmaSense to develop an innovative DSP-based sensing ASIC. This advanced mixed-signal ASIC will feature a state-of-the-art, low-power touch-sense controller chip, seamlessly integrated with SigmaSense's software-defined sensing technology.
The new chip addresses the challenges posed by slimmer displays and high capacitive loads, enabling continuous and precise high-impedance sensing for a seamless user experience. The chip boasts a wide array of applications across automotive, gaming, consumer electronics, and computing sectors, providing SigmaSense customers with unparalleled sensitivity and ultra-low power consumption even in demanding environmental conditions. Additionally, it features a proprietary digital signal processing solution, enhancing programmability for an optimal user experience.
'By leveraging our expertise in pre-silicon design and post-silicon test, we have developed a touch sense control solution that facilitates a smooth progression through the entire development process,' stated Srini Chinamilli, Co-founder and CEO of Tessolve. 'This comprehensive approach effectively addresses the hurdles of conventional methods, resulting in faster time-to-market and enhanced quality for next-generation chip design. Our primary focus was to prioritise stringent power demands through the integration of SigmaSense’s Analog IP and DSP IP into a powerful sensing SOC tailored for 40nm specifications.'
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