Dana Incorporated has signed a long-term agreement with Semikron Danfoss, to secure the supply of silicon-carbide semiconductors, which are designed to be scalable in multiple-chip formats.
The silicon-carbide semiconductors will be used for multiple customer programmes across the light-vehicle, commercial-vehicle, and off-highway mobility markets. These semiconductors will be used in Dana's silicon-carbide inverter designs, which enable higher system efficiency and power density in a compact package for medium-and high-voltage inverter applications, resulting in the potential for increased range, a press release from Dana said.
The release added that the eMPack platform from Semikron Danfoss is optimised for silicon-carbide technology and uses fully sintered direct-pressed die technology, which allows for extremely compact, scalable, and reliable inverters.
Christophe Dominiak, CTO, Dana, noted that the multi-year supply agreement with Semikron Danfoss gives the company a strategic advantage by ensuring it has access to silicon-carbide semiconductors as it expands the use of this technology to deliver innovative, efficient, and powerful solutions for its customers.
Craig Price, Senior Vice President-purchasing and supplier development, Dana, said, 'The agreement secures Dana's ability to meet the growing demand from our customers across a broad range of vehicle applications.'
Siegbert Haumann, Senior Vice President- Automotive Division, Semikron Danfoss, said, “Our modular design, capable of utilising silicon-carbide devices from multiple chip sources, is the ideal module platform for Dana's broad inverter portfolio.”
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