In a bid to offer special EDA tools and simulation solutions to support customer innovation, including bespoke silicon for customisable three-dimensional integrated circuit (3D-IC) designs, Ansys on Monday announced its inaugural partnership to IFS Accelerator – EDA Alliance.
A press release from Ansys said that by leveraging its market-leading multiphysics solutions, IFS Accelerator will make silicon technology available to customers to design uniquely innovative chips. In addition, its cutting-edge EDA and simulation tools will enable mutual customers to reduce design barriers, minimise design risk and cost, and accelerate time-to-market.
The IFS Accelerator will foster collaborative innovation with world-leading EDA, design services and IP partners to provide a comprehensive design ecosystem with premium process technologies, advanced packaging technologies, and manufacturing capabilities.
Rahul Goyal, VP and GM, Intel Product & Design Ecosystem Enablement, 'Together with Ansys and other partners, this alliance will create advanced flows and methodologies, and accelerate productivity by combining our knowledge, resources, and shared passion to drive electronic design.'
The advanced packaging technologies allow multiple chips to be placed together within system-in-package (SiP) designs for significantly increased capacity, performance, and flexibility, leading to entirely new kinds of integrated systems.
John Lee, Vice President & General Manager - Electronics and Semiconductor Business Unit, Ansys, said, 'IFS is built to help meet the growing global demand for semiconductors. It is also a privilege to partner with IFS as one of the leading EDA vendors in its newly formed alliance. We meet this opportunity with enthusiasm and offer our unwavering support to enable our customers to access silicon technology to design with innovation.'