AMD Joins Ansys To Expedite New Product Designs

Mobility Outlook Bureau
19 Apr 2021
06:16 PM
2 Min Read

To help engineering organisations across every industry spur new product design by substantially improving modelling run times, AMD announced a collaboration with Ansys.


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To help engineering organisations across every industry spur new product design by substantially improving modelling run times, AMD announced a collaboration with Ansys. 

Data centres powered by 3rd Gen AMD EPYC processors enable engineers to produce superior designs with unprecedented speed — delivering high-quality products to address new market opportunities swiftly. 

Engineers face increasing pressure to complete design cycle times sooner. However, a large portion of engineering simulations requires overnight runs. The rising complexity of these simulation workloads increases the need for high-performance computing (HPC) resources, which increasingly rely on more performant parallel processing and processor architecture capabilities. 

AMD demonstrated that its new EPYC 75F3 processors could reduce specific Ansys simulation runtimes by up to a factor of two through internal testing.

From improving the energy efficiency of gas turbines with Ansys's computational fluid dynamics software to enhancing automotive safety with Ansys's explicit dynamics software, AMD EPYC processors empower engineering teams to execute extreme scaling of computationally demanding applications and rapidly design leading-edge products. It is expected that Ansys simulations will soon run even faster with the upcoming US Department of Energy's exascale supercomputers, which will be built by Hewlett Packard Enterprise (HPE) and used by Frontier at Oak Ridge National Laboratory and El Capitan at Lawrence Livermore National Laboratory, integrating AMD EPYC processors to produce high-fidelity models. This will supply engineers with insights into how products like autonomous vehicles, aircraft and medical devices will virtually behave across millions of real-world operational scenarios.

Forrest Norrod, Senior Vice President and General Manager, Data Center and Embedded Solutions Business Group, AMD, said, 'Working together, AMD and its technology partners are helping to drive HPC to new heights that will help tackle problems that have previously been beyond humanity's reach.'

Modelling at exascale will empower engineers to analyse considerably more data in less time and solve extremely sophisticated design challenges.

AMD EPYC processors' technological advancements enable engineering organisations of all sizes to solve demanding simulation workloads.

Shane Emswiler, Senior Vice President, Ansys, said, 'AMD EPYC 7003 Series processors are helping Ansys customers provide improved time to value, enabling the quick creation of state-of-the-art designs that deliver fast answers and drive better decisions. We look forward to future collaborations with AMD, which will explore how Ansys's comprehensive suite of simulation solutions can be accelerated using new AMD EPYC processor technologies. This will empower engineering teams to accelerate innovation throughout their enterprise to build next-generation products and win the race to market.'

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